Enables future capacity to support rising demand for Advanced packaging and test

Amkor Technology, Inc. (Nasdaq: AMKR) today reinforced its commitment to expanding Advanced semiconductor packaging and test capabilities in the United States through continued investment in its Arizona manufacturing footprint.

Located within Peoria’s Innovation Core, Amkor’s campus is being developed on a 104-acre site designed to support large-scale, leading-edge semiconductor packaging and test capabilities. As part of its long-term growth strategy, Amkor has now secured an additional 67-acre parcel adjacent to the existing campus, providing strategic flexibility to support future expansion and evolving customer demand.

This expansion builds on Amkor’s previously announced state-of-the-art Advanced packaging and test campus in Arizona. The campus is expected to be the first high-volume Advanced packaging OSAT facility in the United States, supporting the growing demand for advanced semiconductor solutions across artificial intelligence, high-performance computing, automotive, and communications markets.

“Amkor’s investment in Arizona represents a significant step in building advanced semiconductor manufacturing capacity in the United States,” said Kevin Engel, president and chief executive officer of Amkor Technology. “Our continued expansion in Arizona strengthens our ability to support customers with leading-edge packaging and test solutions while contributing to a more resilient global supply chain.”

To hear more about Amkor’s strategic priorities and positioning in the semiconductor industry, register for the Investor Day webcast taking place on Thursday, May 21.

About Amkor Technology, Inc.

Amkor Technology, Inc. (Nasdaq: AMKR) is the world’s largest U.S. headquartered OSAT and is a global leader in outsourced semiconductor packaging and test services. With a strong track record of innovation, a broad and diverse geographic footprint and solid partnerships with lead customers, Amkor delivers high-quality solutions that enable the world’s leading semiconductor and electronics companies to bring advanced technologies to market. The company’s comprehensive portfolio includes advanced packaging, wafer-level processing, and system-in-package solutions targeting applications for smartphones, data centers, artificial intelligence, automobiles and wearables. For more information visit amkor.com.

Amkor Technology, Inc. Forward-Looking Statement Disclaimer

This press release contains forward-looking statements within the meaning of the federal securities laws, including statements about the demand for and expansion of advanced packaging capacity in the United States, growth in demand for accelerated computing driven by AI, and long-term technology roadmaps. You are cautioned not to place undue reliance on forward-looking statements. All forward-looking statements in this press release are made based on our current expectations, forecasts, estimates, and assumptions. Because such statements include risks and uncertainties, actual results may differ materially from those anticipated in such forward-looking statements. Risk factors that could affect the outcome of the events set forth in these statements include, but are not limited to, that there can be no assurance that the Arizona campus will be built on the timeline, at the cost or to the specifications expected or at all or that the campus will generate sales or other benefits of the type or amount expected or at all and other factors discussed in the company’s reports filed with or furnished to the Securities and Exchange Commission. All forward-looking statements attributable to us or persons acting on our behalf are expressly qualified in their entirety by this cautionary statement. We assume no obligation to review or update any forward-looking statements to reflect events or circumstances occurring after the date of this press release except as may be required by applicable law.

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